ESCAPEE European Silicon Carbide Research

TECHNOLOGY

• Sublimation Epitaxy
• Implantation
• Schottky Diodes
• Packaging
• Further Research

Partner: Linkoping University

Linkoping University filed a US Patent Application ("Silicon Carbide epitaxial layer and method of producing the same", ref 60/708786) on 17 Aug 2005, to protect its fast growth sublimation epitaxy process.

The University is currently working with a Swedish consultancy company Accelerator in Linkoping AB to commercialise the technology. Accelerator has established contact with companies in Europe, USA and Japan.